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Plating Processes (under construction) Gold Plating | Aluminum Plating | Copper Plating | Zinc Plating | Nickle Plating | Electroless Plating | Basic Electroplating | Electricity for Electroplates |
 | Gold Plating
Gold plating has been performed commercially for nearly 150 years. Gliding solutions, made from simple chemical constituents, were developed by goldsmiths or jewelers in Europe with beautiful results. In recent years, gold plating has been used as an indistinguishable and economical alternative to karat jewelry, as well as the metal of choice for electronic applications, where its noble character (resistance to oxidation), conductivity and low resistivity make it ideal. Read More... |
 | Aluminum Plating
Aluminum can be plated as easily as any other common metal providing specific processing steps are followed. It is important to remove the natural oxide layer on the surface and replace it with a thin, dense, immersion deposit of zinc, normally referred to as zincate. The surface of the aluminum parts must be free of oil or other contaminants. The cleaning procedure is determined by the amount and type of contaminant present on the surface. Procedures may or may not include an etch.............. Read More... |
 | Electroless Plating
Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates. Electroless plating processes are currently used to deposit metals such as copper, nickel, and gold on selective areas of an electronic package. Many contaminants are introduced into the plating solution during electroless plating because high volumes of substrates are passed through a single plating tank................. Read More... |
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